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Advanced Dicing Technologies

Advanced Dicing Technologies
2003 FOUNDED
PRIVATE STATUS
51-200 EMPLOYEES
Later Stage VC LATEST DEAL TYPE
1 INVESTORS
Description

Manufacturer of dicing equipments. The company engages in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, package singulation and microelectronic components.

Website:
Ownership Status
Privately Held (backing)
Financing Status
Venture Capital-Backed
Primary Industry
Other Commercial Products
Primary Office
5 HaMada Street, P.O. Box 87
Hi-Tech Park (South)
Yokneam 20692
Israel

+972 (0)4 854 5222
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Advanced Dicing Technologies Valuation and Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
1. Later Stage VC 01-Jan-2010 Completed Generating Revenue
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Advanced Dicing Technologies Investors (1)

Investor Name Investor Type Holding Investor Since Participating Rounds Board
Seat
Contact
Info
Teuza Venture Capital Minority 000 0000 000000 0

You’re viewing 1 of 1 investors.

Advanced Dicing Technologies Executive Team (3)

Name Title Board
Seat
Contact
Info
Yaron Barkan President & Chief Executive Officer
Miri Benita Product Manager and Vice President of Marketing and Sales
Netanel Peles Vice President of Marketing and Sales

You’re viewing 3 of 3 executives.