Speedline Technologies Company Profile: Acquisition & Investors

Speedline Technologies Overview

Founded
1988

Status
Acquired/Merged

Employees
1,200

Latest Deal Type
M&A

Financing Rounds
2

Speedline Technologies General Information

Description

Manufacturer and designer of equipment for the surface technology segment of the printed circuit board assembly market. The company also makes reflow ovens, coating equipment, wafer bumping systems, and packaging and encapsulation equipment used in semiconductor manufacturing.

Contact Information

Website

www.speedlinetech.com

Ownership Status

Acquired/Merged

Financing Status

Formerly PE-Backed

Primary Industry

Other Commercial Products

Acquirer

Illinois Tool Works

Primary Office

16 Forge Parkway
Franklin, MA 02038
United States

+1 (508) 000-0000





Want detailed data on 3M+ companies?

What you see here scratches the surface

Request a free trial

Want to dig into this profile?

We’ll help you find what you need

Learn more

Speedline Technologies Valuation & Funding

Deal Type	Date	Amount	Valuation/ EBITDA	Post-Val	Status	Debt

This information is available in the PitchBook Platform. To explore Speedline Technologies‘s full profile, request access.

Request a free trial

Speedline Technologies Patents

265
Total Documents Applications and Grants
000
Total Patents Families
7
Granted
000
Pending
000
Expiring in next 12 mo

Speedline Technologies Recent Patent Activity

Publication ID	Patent Title	Status	First Filing Date	Technology (CPC)	Citations
GB-0901615-D0	Method and apparatus for clamping a substrate	Active	10-Jul-2006	000000000
GB-2453892-B	Method and apparatus for clamping a substrate	Active	10-Jul-2006	000000000	0
GB-2453892-A	Method and apparatus for clamping a substrate	Active	10-Jul-2006	000000000	0
DE-112007001621-B4	Method and device for clamping a substrate	Active	10-Jul-2006	000000000	0
DE-112007001621-T5	Method and device for clamping a substrate	Active	10-Jul-2006	B41F15/26	0