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Speedline Technologies

1988 FOUNDED
M&A STATUS
1K-5K EMPLOYEES
M&A LATEST DEAL TYPE
2 FINANCING ROUNDS
Description

Manufacturer and designer of equipment for the surface technology segment of the printed circuit board assembly market. The company also makes reflow ovens, coating equipment, wafer bumping systems, and packaging and encapsulation equipment used in semiconductor manufacturing.

Ownership Status
Acquired/Merged
Financing Status
Formerly PE-Backed
Primary Industry
Other Commercial Products
Primary Office
  • 16 Forge Parkway
  • Franklin, MA 02038
  • United States

+1 (508) 000-0000

Speedline Technologies Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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Speedline Technologies Former Investors

Investor Name Investor Type Holding Participating Rounds Investor Since Board Seat Contact Info

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Speedline Technologies Executive Team (7)

Name Title Board
Seat
Contact
Info
Jeff Mogensen Vice President
John Ufford Vice President
Wayne Platz Vice President
Kho Wai VP, ASIA

3 Former Executives

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