3DiS Technologies Overview

  • Status
  • Private

  • Employees
  • 4

Employees
  • Latest Deal Type
  • Accelerator/​Inc

  • Latest Deal Amount
  • $64.9K

  • Investors
  • 1

3DiS Technologies General Information

Description

Provider of 3D integration and 3D packaging technology designed for the integration of miniaturized electronic systems and high-performance 3D passive devices. The company's technology offers 3D integrated passive device, 3D interconnects, 3D redistribution layers and water level 3D packaging additionally they also help their customers with each step of their product development from concept, electrical and electromagnetic simulation and custom 3D IPD design, enabling their customer to reduce manufacturing times while designing application and electronic systems.

Contact Information

Ownership Status
Privately Held (backing)
Financing Status
Accelerator/Incubator Backed
Primary Industry
Electrical Equipment
Other Industries
Other Commercial Services
Primary Office
  • 478 rue de la Découverte
  • CS 67624
  • 31676 Labege
  • France
+33 05 00 00 00 00

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3DiS Technologies Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
1. Accelerator/Incubator 23-Apr-2013 $64.9K 000.00 Completed Generating Revenue
To view 3DiS Technologies’s complete valuation and funding history, request access »

3DiS Technologies Patents

3DiS Technologies Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
EP-3350827-A1 Method for integrating at least one 3d interconnection for the manufacture of an integrated circuit Pending 14-Sep-2015 000000000
FR-3041147-B1 Method for integrating at least one 3d interconnect for integrated circuit manufacturing Active 14-Sep-2015 000000000
FR-3041147-A1 Method for integrating at least one 3d interconnect for integrated circuit manufacturing Active 14-Sep-2015 000000000 0
US-20180254258-A1 Method for integrating at least one 3d interconnection for the manufacture of an integrated circuit Active 14-Sep-2015 000000000 00
US-10438923-B2 Method for integrating at least one 3d interconnection for the manufacture of an integrated circuit Active 14-Sep-2015 H01L24/82
To view 3DiS Technologies’s complete patent history, request access »

3DiS Technologies Executive Team (3)

Name Title Board Seat Contact Info
Ayad Ghannam Ph.D Co-Founder, Chief Executive Officer and Chief Technology Officer
Thierry Parra Ph.D Co-Founder & Scientific Adviser
David Bourrier Co-Founder & Technical Adviser
To view 3DiS Technologies’s complete executive team members history, request access »

3DiS Technologies Signals

Growth Rate

0.80% Weekly
Growth
Weekly Growth 0.80%, 93rd %
-35.5%. 530%

Size Multiple

219x Median
Size Multiple 219x, 100th %ile
0.00x 0.95x. 413Kx

Key Data Points

Twitter Followers

5.5k

Similarweb Unique Visitors

15.0K

Majestic Referring Domains

314

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3DiS Technologies Investors (1)

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info
Nubbo Accelerator/Incubator 000 0000 000000 0
To view 3DiS Technologies’s complete investors history, request access »