3DiS Technologies Overview
- Status
-
Private
- Employees
-
4
- Latest Deal Type
-
Accelerator/Inc
- Latest Deal Amount
-
$64.9K
- Investors
-
1
3DiS Technologies General Information
Description
Provider of 3D integration and 3D packaging technology designed for the integration of miniaturized electronic systems and high-performance 3D passive devices. The company's technology offers 3D integrated passive device, 3D interconnects, 3D redistribution layers and water level 3D packaging additionally they also help their customers with each step of their product development from concept, electrical and electromagnetic simulation and custom 3D IPD design, enabling their customer to reduce manufacturing times while designing application and electronic systems.
Contact Information
Website
www.3dis-tech.com
Ownership Status
Privately Held (backing)
Financing Status
Accelerator/Incubator Backed
Primary Industry
Electrical Equipment
Other Industries
Other Commercial Services
Primary Office
- 478 rue de la Découverte
- CS 67624
- 31676 Labege
- France
+33 05 00 00 00 00
3DiS Technologies Valuation & Funding
| Deal Type | Date | Amount | Raised to Date | Post-Val | Status | Stage |
|---|---|---|---|---|---|---|
| 1. Accelerator/Incubator | 23-Apr-2013 | $64.9K | 000.00 | Completed | Generating Revenue |
3DiS Technologies Patents
3DiS Technologies Recent Patent Activity
| Publication ID | Patent Title | Status | First Filing Date | Technology (CPC) | Citations |
|---|---|---|---|---|---|
| EP-3350827-A1 | Method for integrating at least one 3d interconnection for the manufacture of an integrated circuit | Pending | 14-Sep-2015 | 000000000 | |
| FR-3041147-B1 | Method for integrating at least one 3d interconnect for integrated circuit manufacturing | Active | 14-Sep-2015 | 000000000 | |
| FR-3041147-A1 | Method for integrating at least one 3d interconnect for integrated circuit manufacturing | Active | 14-Sep-2015 | 000000000 | 0 |
| US-20180254258-A1 | Method for integrating at least one 3d interconnection for the manufacture of an integrated circuit | Active | 14-Sep-2015 | 000000000 | 00 |
| US-10438923-B2 | Method for integrating at least one 3d interconnection for the manufacture of an integrated circuit | Active | 14-Sep-2015 | H01L24/82 |
3DiS Technologies Executive Team (3)
3DiS Technologies Signals
Growth Rate
0.80%
Weekly
Growth
Growth
Weekly Growth
0.80%, 93rd %
-35.5%.
530%
Size Multiple
219x
Median
Size Multiple
219x, 100th %ile
0.00x
0.95x.
413Kx
Key Data Points
Twitter Followers
5.5k
Similarweb Unique Visitors
15.0K
Majestic Referring Domains
314
3DiS Technologies Investors (1)
| Investor Name | Investor Type | Holding | Investor Since | Participating Rounds | Contact Info |
|---|---|---|---|---|---|
| Nubbo | Accelerator/Incubator | 000 0000 | 000000 0 |