ASE Embedded Electronics Overview

  • Status
  • Private

  • Latest Deal Type
  • Joint Venture

  • Financing Rounds
  • 1

ASE Embedded Electronics General Information

Description

Manufacturer of IC embedded substrates. The company uses the semiconductor embedded in substrate technology and offers semiconductor manufacturing services.

Contact Information

Ownership Status
Privately Held (backing)
Financing Status
Corporate Backed or Acquired
Primary Industry
General Purpose Semiconductors
Other Industries
Production (Semiconductors)
Primary Office
  • Taiwan

Want detailed data on 3M+ companies?

What you see here scratches the surface

Request a free trial

Want to dig into this profile?

We’ll help you find what you need

Learn more

ASE Embedded Electronics Valuation & Funding

Deal Type Date Amount Valuation/
EBITDA		 Post-Val Status Debt

This information is available in the PitchBook Platform. To explore ASE Embedded Electronics‘s full profile, request access.

Request a free trial

ASE Embedded Electronics Patents

  • 3

    Total Documents Applications and Grants

  • 000

    Total Patents Families

  • 1

    Granted

  • 000

    Pending

  • 000

    Expiring in next 12 mo

ASE Embedded Electronics Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
JP-2020184603-A Embedded component package structure and manufacturing method thereof Active 29-Apr-2019 000000000 0
US-20200343188-A1 Embedded component package structure and manufacturing method thereof Active 29-Apr-2019 000000000 00
US-10950551-B2 Embedded component package structure and manufacturing method thereof Active 29-Apr-2019 H01L23/5384 00

ASE Embedded Electronics Investors

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info

This information is available in the PitchBook Platform. To explore ASE Embedded Electronics‘s full profile, request access.

Request a free trial