Cubic Memory Overview

  • Status
  • Acquired/​Merged
  • Latest Deal Type
  • Merger of Eq.

Cubic Memory General Information

Description

Provider of ultra-dense packaging technology. The company manufactures 3D memory technology for computers, communication networks and portable systems.

Contact Information

Ownership Status
Acquired/Merged
Financing Status
Formerly VC-backed
Primary Industry
Application Specific Semiconductors
Acquirer
Vertical Circuits
Primary Office
  • Scotts Valley, CA
  • United States
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Cubic Memory Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
2. Merger of Equals 01-Nov-1999 0000 Completed Startup
1. Early Stage VC 0000 0000 Completed Startup
To view Cubic Memory’s complete valuation and funding history, request access »

Cubic Memory Patents

Cubic Memory Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
US-6177296-B1 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform Expired - Lifetime 23-Jun-1994 000000000 00
US-5891761-A Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform Expired - Lifetime 23-Jun-1994 000000000 000

Cubic Memory Former Investors (1)

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info
Friedli Corporate Finance Venture Capital Minority 000 0000 000000 0
To view Cubic Memory’s complete investors history, request access »