Get a glimpse into our company and investor data—powered by the PitchBook Platform
$10.24SHARE PRICE(As of Friday Closing)
Developer of wet processing technology and products. The company uses its proprietary space alternated phase shift (SAPS) and timely energized bubble oscillation (TEBO) and megasonic cleaning technologies to manufacture equipment for a range of applications in integrated circuit (IC) manufacturing and wafer level packaging. It caters to the requirements of the semiconductor manufacturers.