INCEP Technologies Overview

  • Founded
  • 1998
  • Status
  • Acquired/​Merged
  • Latest Deal Type
  • M&A

INCEP Technologies General Information


Developer of inter-circuit encapsulated packaging, designed to addressissues associated with high-performance semiconductor devices. The company offers integrated packaging and interconnect systems as well as related services required to architect, design and develop high levels of electronic system integration through innovative circuit packaging, device interconnection and assembly processes at the chip, board, and system levels, enabling practical system use of very high power microelectronics.

Contact Information

Ownership Status
Financing Status
Formerly VC-backed
Primary Industry
Connectivity Products
Other Industries
Other Semiconductors
Primary Office
  • 10650 Treena Street
  • Suite 308
  • San Diego, CA 92131
  • United States
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INCEP Technologies Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
2. Merger/Acquisition 15-Sep-2004 00.000 Completed Generating Revenue
1. Early Stage VC (Series B) 01-Jul-2002 00.000 00.000 Completed Generating Revenue
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INCEP Technologies Executive Team (3)

Name Title Board Seat Contact Info
James Kaskade Co-Founder, President, Board Member & Chief Executive Officer
Jim Dietz Chief Operating Officer
J. DiBene Chief Technical Officer
To view INCEP Technologies’s complete executive team members history, request access »

INCEP Technologies Former Investors (1)

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info
Top Tier Capital Partners Venture Capital Minority 000 0000 000000 0
To view INCEP Technologies’s complete investors history, request access »