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Applied Materials (semiconductor patent)

M&A STATUS
Asset Purch. LATEST DEAL TYPE
1 FINANCING ROUNDS
Description

A portfolio of semiconductor applications. The asset comprises of technology and systems used in semiconductor applications for measuring implant and metal thickness.

Ownership Status
Acquired/Merged
Financing Status
Corporate Backed or Acquired
Primary Industry
Industrial Supplies and Parts
Acquirer
Primary Office
  • 3050 Bowers Avenue
  • P.O. Box 58039
  • Santa Clara, CA 95054
  • United States

Applied Materials (semiconductor patent) Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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Applied Materials (semiconductor patent) Former Investors

Investor Name Investor Type Holding Participating Rounds Investor Since Board Seat Contact Info

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