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UTStarcom (System-On-Chip Division)

M&A STATUS
M&A LATEST DEAL TYPE
1 FINANCING ROUNDS
Description

Manufacturer of system on chip circuit for personal handyphone. The company's system are primarily focused on developing wireless communications system including 3G wireless application technologies and silicon solutions.

Ownership Status
Acquired/Merged
Financing Status
Corporate Backed or Acquired
Primary Industry
Wireless Communications Equipment
Primary Office
  • Level 6, 28 Hennessy Road
  • Admiralty
  • Hong Kong
  • Hong Kong

UTStarcom (System-On-Chip Division) Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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UTStarcom (System-On-Chip Division) Former Investors

Investor Name Investor Type Holding Participating Rounds Investor Since Board Seat Contact Info

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