Tong Hsing Electronic Industries Ltd is a Taiwan-based company that is principally engaged in developing, manufacturing, and selling hybrid integrated circuits, image sensors, metalized ceramic substrates, RF modules, and others. The company has three business segments: BU1, which is involved in the process of plating SF with gold; BU2, which is engaged in the processes of Tong Hsing Electronics (Philippines); and BU3, which is involved in CO2, nonplating SF with gold, SMT, AS, RW, and CP. BU3 contributes over half of total revenue. The company generates the majority of total revenue from overseas markets, including the United States, Singapore, Luxembourg, and Malaysia.