Tong Hsing Electronic Industries Overview
- Founded
-
1974
- Status
-
Public
- Employees
-
186
- Stock Symbol
-
6271
- Investments
-
1
- Share Price
-
$5.91
- (As of Friday Closing)
Tong Hsing Electronic Industries General Information
Description
Tong Hsing Electronic Industries Ltd is a Taiwan-based company that is principally engaged in developing, manufacturing, and selling hybrid integrated circuits, image sensors, metalized ceramic substrates, RF modules, and others. The company has three business segments: BU1, which is involved in the process of plating SF with gold; BU2, which is engaged in the processes of Tong Hsing Electronics (Philippines); and BU3, which is involved in CO2, nonplating SF with gold, SMT, AS, RW, and CP. BU3 contributes over half of the total revenue. The company generates the majority of its total revenue from overseas markets, including the United States, Singapore, and Malaysia.
Contact Information
Primary Industry
Application Specific Semiconductors
Other Industries
Production (Semiconductors)
Stock Exchange
TAI
Primary Office
- Number 55, Lane 365, Yingtao Road
- Yinko District
- New Taipei, Yinko
- Taiwan
+886 02 0000 0000#0000
Tong Hsing Electronic Industries Stock Performance
(As of Friday Closing)
| Stock Price | Previous Close | 52 wk Range | Market Cap | Shares | Average Volume | EPS |
|---|---|---|---|---|---|---|
| $5.91 | $6.18 | $5.83 - $11.63 | $1.06B | 179M | 2.06M | $0.71 |
Tong Hsing Electronic Industries Financials Summary
|
In Thousands, USD |
TTM 30-Jun-2022 | FY 2021 31-Dec-2021 | FY 2020 31-Dec-2020 | FY 2019 31-Dec-2019 |
|---|---|---|---|---|
| EV | 1,037,627 | 1,772,325 | 984,590 | 765,234 |
| Revenue | 507,937 | 495,986 | 345,772 | 240,466 |
| EBITDA | 211,316 | 177,303 | 97,704 | 54,052 |
| Net Income | 126,077 | 98,935 | 49,283 | 24,011 |
| Total Assets | 1,030,597 | 994,552 | 911,955 | 414,784 |
| Total Debt | 40,604 | 7,545 | 18,961 | 4,300 |
Public Fundamental Data provided by Morningstar, Inc.
disclaimer
Tong Hsing Electronic Industries Valuation & Funding
| Deal Type | Date | Amount | Valuation/ EBITDA |
Post-Val | Status | Debt |
|---|
Tong Hsing Electronic Industries Comparisons
Description
Primary
Industry
Industry
HQ Location
Employees
Total Raised
Post Valuation
Last Financing Details
Tong Hsing Electronic Industries Ltd is a Taiwan-based company that is principally engaged in developing, manufacturing,
Application Specific Semiconductors
New Taipei, Taiwan
186
As of 2021
00000000
000000
et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut a
0000000000 (00000000000000)
Malvern, PA
00000
As of 0000
00000
00000000000
00000
000000
uis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur
0000000 0000000 00000000000000
Singapore, Singapore
0000
As of 0000
00000000
Add Comparison
Tong Hsing Electronic Industries Competitors (12)
| Company Name | Financing Status | Location | Employees | Total Raised | Last Financing Date/Type | Last Financing Amount |
|---|---|---|---|---|---|---|
| Vishay Intertechnology | Corporation | Malvern, PA | 00000 | 00000 | 00000000000 | 00000 |
| 0000000 & 00000 00 | Corporation | Singapore, Singapore | 0000 | 00000000 | ||
| 00000 0000000 | Formerly PE-Backed | Singapore, Singapore | 00000 | 00000 | 000000&0 | |
| 0000000000000 0000 | Formerly VC-backed | Shanghai, China | 00000 | 000.00 | 00000000 | 000.00 |
| 00000 0000000000 | Formerly PE-Backed | Tempe, AZ | 00000 | 00.00 | 000000 - 000 | 00.00 |
Tong Hsing Electronic Industries Patents
Tong Hsing Electronic Industries Recent Patent Activity
| Publication ID | Patent Title | Status | First Filing Date | Technology (CPC) | Citations |
|---|---|---|---|---|---|
| US-20210134702-A1 | Electronic device having a chip package module | Pending | 31-Oct-2019 | 00000000000 | |
| US-20220254826-A1 | Method of manufacturing image sensing chip package structure including an adhesive loop | Pending | 26-Jun-2019 | 000000000000 | |
| US-20200411574-A1 | Image sensing chip package structure and method of manufacturing the same | Active | 26-Jun-2019 | 000000000000 | |
| US-11411029-B2 | Image sensing chip package structure including adhesive loop | Active | 26-Jun-2019 | 000000000000 | 0 |
| US-10867158-B2 | Process for making a fingerprint sensor package module and the fingerprint sensor package module made thereby | Active | 29-Jun-2018 | G06V40/12 |
Tong Hsing Electronic Industries Executive Team (3)
| Name | Title | Board Seat | Contact Info |
|---|---|---|---|
| Jay Yang | Chief Executive Officer & Chairman | ||
| Heinz Ru | President & Senior Vice President | ||
| Shaoping Lu | General Manager |
Tong Hsing Electronic Industries Board Members (1)
| Name | Representing | Role | Since |
|---|---|---|---|
| Jay Yang | Tong Hsing Electronic Industries | Chief Executive Officer & Chairman | 000 0000 |
Tong Hsing Electronic Industries Signals
Growth Rate
0.80%
Weekly
Growth
Growth
Weekly Growth
0.80%, 93rd %
-35.5%.
530%
Size Multiple
219x
Median
Size Multiple
219x, 100th %ile
0.00x
0.95x.
413Kx
Key Data Points
Twitter Followers
5.5k
Similarweb Unique Visitors
15.0K
Majestic Referring Domains
314
Tong Hsing Electronic Industries Acquisitions (1)
| Company Name | Deal Date | Deal Type | Deal Size | Industry | Lead Partner |
|---|---|---|---|---|---|
| 0000000 00000 | 08-Jun-2020 | 0000000000 | Computers, Parts and Peripherals |
Tong Hsing Electronic Industries Subsidiaries (1)
| Company Name | Industry | Location | Founded |
|---|---|---|---|
| 0000000 0000000000 | Computers, Parts and Peripherals | Zhubei, Taiwan | 0000 |