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Hermes Microvision

Hermes Microvision
1998 FOUNDED
M&A STATUS
601-700 EMPLOYEES
M&A LATEST DEAL TYPE
1 FINANCING ROUNDS
Description

Manufacturer of E-beam Inspection (EBI) tools for the leading semiconductor manufacturing fabs. The company supplies multiple product lines, including eScan Series / ePTM Series / eXplore Series, for various R&D and production applications. The e-beam system used by HMI is ideally positioned for sub-10 nm logic nodes, because of e-beam's ability to see in great detail even the tiniest features on these very advanced chips.

Ownership Status
Acquired/Merged
(Operating Subsidiary)
Financing Status
Corporate Backed or Acquired
Primary Industry
Application Specific Semiconductors
Parent Company
Primary Office
  • 7F, Number 18, Puding Road, Eastern District
  • Hsinchu City, 300
  • Taiwan

+886 03 000 0000

Hermes Microvision Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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Hermes Microvision Competitors (3)

Company Name Financing Status Location Employees Total Raised Last Financing Date/Type Last Financing Amount
MagnaChip Semiconductor Formerly PE-Backed Cheongju, South Korea 0000 00000 00000000000 00000
00000 Corporate Backed or Acquired San Jose, CA 0000 000000&0
000000 0000000000 Corporate Backed or Acquired Milpitas, CA 0000 000.00 000000&0 000.00
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Hermes Microvision Former Investors

Investor Name Investor Type Holding Participating Rounds Investor Since Board Seat Contact Info

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Hermes Microvision Executive Team (3)

Name Title Board
Seat
Contact
Info
Jack Jau Chief Executive Officer
Chung-Shih Pan President & Chief Operating Officer
Leo Hsiao-Lien Shen Vice President of Finance & Chief Financial Officer