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Allvia (Patent Assets)

M&A STATUS
Asset Purch. LATEST DEAL TYPE
1 FINANCING ROUNDS
Description

Portfolio of 64 technology patents and patent applications. The portfolio includes patents related to 3-dimensional integrated circuit packaging technology, through-silicon via (TSV) technology and silicon interposer technology.

Ownership Status
Acquired/Merged
Financing Status
Corporate Backed or Acquired
Primary Industry
Other Business Products and Services
Other Industries
Other Information Technology
Acquirer
Invensas
Primary Office
  • 657 North Pastoria Avenue
  • Sunnyvale, CA 94085
  • United States

Allvia (Patent Assets) Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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Allvia (Patent Assets) Former Investors

Investor Name Investor Type Holding Participating Rounds Investor Since Board Seat Contact Info

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