Tracit Technologies Overview

  • Founded
  • 2003
  • Status
  • Acquired/​Merged
  • Latest Deal Type
  • M&A

Tracit Technologies General Information


Producer of wafers suitable for fabrication of micro-electro mechanical (MEMS) and power circuits. The company develops thin layer transfer technologies that leverage molecular adhesion and mechanical, as well as chemical, thinning processes. It industrializes processes using direct wafer bonding and mechanical thinning bond. It has spun out from Cea Leti.

Contact Information

Ownership Status
Financing Status
Formerly VC-backed
Primary Industry
Electronic Components
Other Industries
Other Semiconductors
Industrial Supplies and Parts
Other Commercial Products
Primary Office
  • Centr'Alp, 52
  • Rue Corporat
  • 38430 Moirans
  • France
+33 04 00 00 00 00
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Tracit Technologies Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
2. Merger/Acquisition 31-Jul-2006 00.000 Completed Product Development
1. Early Stage VC 01-Nov-2003 00.000 00.000 Completed Product Development
To view Tracit Technologies’s complete valuation and funding history, request access »

Tracit Technologies Former Investors (3)

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info
ACE Management Equity Partner PE/Buyout Minority 000 0000 000000 0
CEA Investissement Corporate Venture Capital Minority 000 0000 000000 0
Emertec Gestion Venture Capital Minority 000 0000 000000 0
To view Tracit Technologies’s complete investors history, request access »