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Telink Semiconductor

Telink Semiconductor?uq=UG6efJS6
2010 FOUNDED
PRIVATE STATUS
21-30 EMPLOYEES
Later Stage VC LATEST DEAL TYPE
1 INVESTORS
Description

Developer of radio-frequency and mixed signal system chips designed to be use for Internet of Things (IoT) applications. The company's radio-frequency and mixed signal system chips can be use for consumer electronics, medical instruments and home automation, enabling consumers to use low cost IoT chips making the devices affordable.

Ownership Status
Privately Held (backing)
Financing Status
Venture Capital-Backed
Primary Industry
Production (Semiconductors)
Other Industries
General Purpose Semiconductors
Primary Office
  • Building 3, Number 1500, Zuchongzhi Road
  • Zhangjiang Hi-tech Park
  • Shanghai, 201203
  • China

+86 021 0000 0000
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Telink Semiconductor Valuation and Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
1. Later Stage VC 17-Sep-2015 Completed Generating Revenue
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Telink Semiconductor Investors (1)

Investor Name Investor Type Holding Investor Since Participating Rounds Board
Seat
Contact
Info
Intel Capital Corporate Venture Capital Minority 000 0000 000000 0

Telink Semiconductor Executive Team (5)

Name Title Board
Seat
Contact
Info
Wenjun Sheng Ph.D Chairman & Chief Executive Officer
Haipeng Jin Ph.D Co-Founder
Mingjian Zheng Co-Founder
Bo Wang Ph.D Vice President, Marketing
Xun Xie Vice President, Operations

Telink Semiconductor Board Members (1)

Name Representing Role Since Contact
Info
Wenjun Sheng Ph.D Telink Semiconductor Chairman & Chief Executive Officer 000 0000