Telink Semiconductor Overview

  • Founded
  • 2010
Founded
  • Status
  • Private
  • Employees
  • 27
Employees
  • Latest Deal Type
  • Later Stage VC
  • Investors
  • 2

Telink Semiconductor General Information

Description

Developer of radio-frequency and mixed signal system chips designed to be use for Internet of Things (IoT) applications. The company's radio-frequency and mixed signal system chips can be use for consumer electronics, medical instruments and home automation, enabling consumers to use low cost IoT chips making the devices affordable.

Contact Information

Ownership Status
Privately Held (backing)
Financing Status
Venture Capital-Backed
Primary Industry
Production (Semiconductors)
Other Industries
General Purpose Semiconductors
Primary Office
  • Building 3, Number 1500, Zuchongzhi Road
  • Zhangjiang Hi-tech Park
  • Shanghai, 201203
  • China
+86 021 0000 0000
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Telink Semiconductor Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
8. Later Stage VC 26-Mar-2020 Completed Generating Revenue
7. Later Stage VC 29-May-2018 Completed Generating Revenue
6. Merger/Acquisition 10-Aug-2017 00000 00000 Completed Generating Revenue
5. Later Stage VC 23-Feb-2017 Completed Generating Revenue
4. Later Stage VC 30-Dec-2016 Completed Generating Revenue
3. Later Stage VC 17-Sep-2015 Completed Generating Revenue
2. Early Stage VC 30-Sep-2013 Completed Startup
1. Early Stage VC 28-Aug-2012 Completed Startup
To view Telink Semiconductor’s complete valuation and funding history, request access »

Telink Semiconductor Patents

Telink Semiconductor Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
EP-3820128-A1 Method of allocating time slots for wireless headset, and wireless headset using the same Pending 06-Nov-2019 00000000000
US-20210136756-A1 Method of allocating time slots for wireless headset, and wireless headset using the same Pending 06-Nov-2019 00000000
EP-3742194-A1 Method and device for measuring distance between wireless nodes Pending 21-May-2019 000000000
US-20200371225-A1 Method and device for measuring distance between wireless nodes Pending 21-May-2019 000000000
US-10652645-B2 Wireless headset and signal transmission method for the same Active 17-Sep-2018 H04R1/1041

Telink Semiconductor Executive Team (5)

Name Title Board Seat Contact Info
Wenjun Sheng Ph.D Chairman & Chief Executive Officer
Haipeng Jin Ph.D Co-Founder
Mingjian Zheng Co-Founder
Bo Wang Ph.D Vice President, Marketing
Xun Xie Vice President, Operations
To view Telink Semiconductor’s complete executive team members history, request access »

Telink Semiconductor Board Members (1)

Name Representing Role Since
Wenjun Sheng Ph.D Telink Semiconductor Chairman & Chief Executive Officer 000 0000
To view Telink Semiconductor’s complete board members history, request access »

Telink Semiconductor Signals

Growth Rate

0.80% Weekly
Growth
Weekly Growth 0.80%, 93rd %ile
-35.5%. 530%

Size Multiple

219x Median
Size Multiple 219x, 100th %ile
0.00x 0.95x. 413Kx

Key Data Points

Twitter Followers

5.5k

Similarweb Unique Visitors

15.0K

Majestic Referring Domains

314

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Telink Semiconductor Investors (2)

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info
SINO-IC Capital PE/Buyout Minority 000 0000 000000 0
Stalagnate Capital Venture Capital Minority 000 0000 000000 0
To view Telink Semiconductor’s complete investors history, request access »

Telink Semiconductor Investments (1)

Company Name Deal Date Deal Type Deal Size Industry Lead Partner
000000 13-Nov-2020 00000 0000 0000 Application Specific Semiconductors
To view Telink Semiconductor’s complete investments history, request access »