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Moldec

Moldec
1983 FOUNDED
M&A STATUS
Corporate LATEST DEAL TYPE
3 FINANCING ROUNDS
Description

Provider of precision electronic parts for electronic devices. The company manufactures and designs precision electronic parts for personal computers, mobile devices, digital consumer electronics and office automation equipment.

Ownership Status
Acquired/Merged
(Operating Subsidiary)
Financing Status
Corporate Backed or Acquired
Primary Industry
Industrial Supplies and Parts
Other Industries
Electronic Components
Parent Company
Primary Office
  • 24-1, Higashi, Ohyama
  • Ohtama-mura, Adachigun
  • Fukushima-ken, 969-1301
  • Japan

+81 0000-00-0000

Moldec Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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Moldec Former Investors

Investor Name Investor Type Holding Participating Rounds Investor Since Board Seat Contact Info

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Moldec Executive Team (1)

Name Title Board
Seat
Contact
Info
Minoru Ichihashi Chief Executive Officer & President