Moldec
1983
FOUNDED
M&A
STATUS
Corporate
LATEST DEAL TYPE
3
FINANCING ROUNDS
Description
Provider of precision electronic parts for electronic devices. The company manufactures and designs precision electronic parts for personal computers, mobile devices, digital consumer electronics and office automation equipment.
Website
Ownership Status
Acquired/Merged
(Operating Subsidiary)
(Operating Subsidiary)
Financing Status
Corporate Backed or Acquired
Primary Industry
Industrial Supplies and Parts
Other Industries
Electronic Components
Parent Company
Primary Office
- 24-1, Higashi, Ohyama
- Ohtama-mura, Adachigun
- Fukushima-ken, 969-1301
- Japan
+81 0000-00-0000
Moldec Valuation and Funding
| Deal Type | Date | Amount | Post-Val | Valuation/ EBITDA |
Debt | Status |
|---|
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| Investor Name | Investor Type | Holding | Participating Rounds | Investor Since | Board Seat | Contact Info |
|---|
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