Moldec Overview

  • Founded
  • 1983

Founded
  • Status
  • Acquired/​Merged

  • Latest Deal Type
  • Corporate

  • Financing Rounds
  • 3

Moldec General Information

Description

Provider of precision electronic parts for electronic devices. The company manufactures and designs precision electronic parts for personal computers, mobile devices, digital consumer electronics and office automation equipment.

Contact Information

Ownership Status
Acquired/Merged
(Operating Subsidiary)
Financing Status
Corporate Backed or Acquired
Primary Industry
Industrial Supplies and Parts
Other Industries
Electronic Components
Parent Company
Primary Office
  • 24-1, Higashi, Ohyama
  • Ohtama-mura, Adachigun
  • Fukushima-ken, 969-1301
  • Japan
+81 0000-00-0000

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Moldec Valuation & Funding

Deal Type Date Amount Valuation/
EBITDA
Post-Val Status Debt

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Moldec Patents

Moldec Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
JP-2003157942-A Connector and manufacturing method of the same Active 13-Jul-2001 000000000
US-6679709-B2 Connector and method for manufacturing same Inactive 13-Jul-2001 000000000
US-20030013330-A1 Connector and method for manufacturing same Active 13-Jul-2001 000000000
US-6474998-B1 Connector Inactive 28-Jun-2001 000000000 0
EP-1238774-A1 Method of forming receptacle connector insert Inactive 30-Nov-1999 H01R43/24 0
To view Moldec’s complete patent history, request access »

Moldec Executive Team (1)

Name Title Board Seat Contact Info
Minoru Ichihashi Chief Executive Officer & President
To view Moldec’s complete executive team members history, request access »

Moldec Former Investors

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info

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