Packaging Technologies Overview

  • Founded
  • 1995
  • Status
  • Acquired/​Merged
  • Employees
  • 100
  • Latest Deal Type
  • M&A

Packaging Technologies General Information


Manufacturer of equipment for microelectronic and advanced packaging industries. The company develops Flip Chip technology to increase the integratability of electronic components on circuit boards. It specializes in electroless under-bump-metallization and solder ball placement. The company was spun out of Fraunhofer Institute.

Contact Information

Ownership Status
Financing Status
Formerly VC-backed
Primary Industry
Electrical Equipment
Other Industries
Other Commercial Products
Application Specific Semiconductors
Primary Office
  • Am Schlangenhorst 15-17
  • 14641 Nauen
  • Germany
+49 03321 0000000
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Packaging Technologies Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
2. Merger/Acquisition 01-Jan-2009 Completed Product Development
1. Early Stage VC 01-Jan-2000 Completed Product Development
To view Packaging Technologies’s complete valuation and funding history, request access »

Packaging Technologies Executive Team (1)

Name Title Board Seat Contact Info
Elke Zakel Chief Executive Officer & President
To view Packaging Technologies’s complete executive team members history, request access »

Packaging Technologies Signals

Growth Rate

0.80% Weekly
Weekly Growth 0.80%, 93rd %ile
-35.5%. 530%

Size Multiple

219x Median
Size Multiple 219x, 100th %ile
0.00x 0.95x. 413Kx

Key Data Points

Twitter Followers


Similarweb Unique Visitors


Majestic Referring Domains


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Packaging Technologies Former Investors (2)

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info
Berlin Capital Venture Capital Minority 000 0000 000000 0
Brandenburg Kapital Venture Capital Minority 000 0000 000000 0
To view Packaging Technologies’s complete investors history, request access »