Packaging Technologies Overview
- Founded
-
1995
- Status
-
Acquired/Merged
- Employees
-
100
- Latest Deal Type
-
M&A
Packaging Technologies General Information
Description
Manufacturer of equipment for microelectronic and advanced packaging industries. The company develops Flip Chip technology to increase the integratability of electronic components on circuit boards. It specializes in electroless under-bump-metallization and solder ball placement. The company was spun out of Fraunhofer Institute.
Contact Information
Primary Industry
Electrical Equipment
Other Industries
Other Commercial Products
Application Specific Semiconductors
Acquirer
Primary Office
- Am Schlangenhorst 15-17
- 14641 Nauen
- Germany
+49 03321 0000000
Packaging Technologies Valuation & Funding
| Deal Type | Date | Amount | Raised to Date | Post-Val | Status | Stage |
|---|---|---|---|---|---|---|
| 2. Merger/Acquisition | 01-Jan-2009 | Completed | Product Development | |||
| 1. Early Stage VC | 01-Jan-2000 | Completed | Product Development |
Packaging Technologies Patents
Packaging Technologies Recent Patent Activity
| Publication ID | Patent Title | Status | First Filing Date | Technology (CPC) | Citations |
|---|---|---|---|---|---|
| DE-202022105493-U1 | Deposition station and device for producing contact metallization | Active | 29-Sep-2022 | 000000000 | 0 |
| DE-102022121665-A1 | Press molding device for the production of individual solder bodies; soldering device; solder application machine; and procedures | Pending | 06-Oct-2021 | 0000000000 | 0 |
| US-20230105729-A1 | Press-forming device for depositing solder and producing individual solder bodies | Pending | 06-Oct-2021 | 0000000000 | |
| DE-102022120336-A1 | Laser soldering device and solder application machine | Pending | 06-Oct-2021 | 0000000000 | 0 |
| US-20230105144-A1 | Laser-assisted soldering apparatus and solder deposition machine | Pending | 06-Oct-2021 | B23K3/0623 |
Packaging Technologies Executive Team (1)
| Name | Title | Board Seat | Contact Info |
|---|---|---|---|
| Elke Zakel | Chief Executive Officer & President |
Packaging Technologies Signals
Growth Rate
0.80%
Weekly
Growth
Growth
Weekly Growth
0.80%, 93rd %
-35.5%.
530%
Size Multiple
219x
Median
Size Multiple
219x, 100th %ile
0.00x
0.95x.
413Kx
Key Data Points
Twitter Followers
5.5k
Similarweb Unique Visitors
15.0K
Majestic Referring Domains
314
Packaging Technologies Former Investors (2)
| Investor Name | Investor Type | Holding | Investor Since | Participating Rounds | Contact Info |
|---|---|---|---|---|---|
| Berlin Capital | Venture Capital | Minority | 000 0000 | 000000 0 | |
| Brandenburg Kapital | Venture Capital | Minority | 000 0000 | 000000 0 |