FlipChip International Overview
- Year Founded
-
1996
- Status
-
Acquired/Merged
- Employees
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501
- Latest Deal Type
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M&A
- Financing Rounds
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6
- Investments
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1
FlipChip International General Information
Description
Provider of flip chip bumping and advanced wafer level packaging services intended to provide engineering excellence in device miniaturization and innovation. The company's flip chip bumping and advanced wafer level packaging services is a method for interconnecting semiconductor devices to external circuitry with solder bumps deposited onto chip pads, enabling automotive, commercial, consumer, industrial, medical and military markets to get more processing power out of chips by layering wafers together giving a device more computing power.
Contact Information
Website
www.flipchip.comCorporate Office
- 3701 East University Drive
- Phoenix, AZ 85034
- United States
Corporate Office
- 3701 East University Drive
- Phoenix, AZ 85034
- United States
FlipChip International Valuation & Funding
| Deal Type | Date | Amount | Valuation/ EBITDA |
Post-Val | Status | Debt |
|---|
FlipChip International Patents
FlipChip International Recent Patent Activity
| Publication ID | Patent Title | Status | First Filing Date | Technology (CPC) | Citations |
|---|---|---|---|---|---|
| US-20160268223-A1 | Methods for forming pillar bumps on semiconductor wafers | Active | 11-Mar-2015 | ||
| US-9831201-B2 | Methods for forming pillar bumps on semiconductor wafers | Inactive | 11-Mar-2015 | ||
| WO-2014209629-A1 | Electroplating using dielectric bridges | Inactive | 27-Jun-2013 | ||
| EP-2878010-A1 | Method for applying a final metal layer for wafer level packaging and associated device | Inactive | 12-Jun-2012 | ||
| EP-2878010-A4 | Method for applying a final metal layer for wafer level packaging and associated device | Inactive | 12-Jun-2012 | H10W20/425 |
FlipChip International Signals
Growth Rate
Growth
Size Multiple
Key Data Points
Similarweb Unique Visitors
Majestic Referring Domains
FlipChip International Former Investors
| Investor Name | Investor Type | Holding | Investor Since | Participating Rounds | Contact Info |
|---|
FlipChip International Acquisitions (1)
FlipChip International’s most recent deal was a Merger/Acquisition with Millennium Microtech. The deal was made on 09-Jul-2012.
| Company Name | Deal Date | Deal Type | Deal Size | Industry | Lead Partner |
|---|---|---|---|---|---|
| Millennium Microtech | 09-Jul-2012 | Merger/Acquisition | General Purpose Semiconductors |
FlipChip International FAQs
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When was FlipChip International founded?
FlipChip International was founded in 1996.
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Where is FlipChip International headquartered?
FlipChip International is headquartered in Phoenix, AZ.
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What is the size of FlipChip International?
FlipChip International has 501 total employees.
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What industry is FlipChip International in?
FlipChip International’s primary industry is Other Commercial Services.
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Is FlipChip International a private or public company?
FlipChip International is a Private company.
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What is the current valuation of FlipChip International?
The current valuation of FlipChip International is .
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What is FlipChip International’s current revenue?
The current revenue for FlipChip International is .
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How much funding has FlipChip International raised over time?
FlipChip International has raised $35M.
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Who are FlipChip International’s investors?
Delco Electronics, Kulicke and Soffa Industries, Point Financial, and RoseStreet Labs have invested in FlipChip International.
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When was FlipChip International acquired?
FlipChip International was acquired on 01-Apr-2015.
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Who acquired FlipChip International?
FlipChip International was acquired by HT-Tech.
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