Description
Provider of packaging, qualification and testing services intended to be used for sensors and advanced (Integrated Circuit) IC packaging. The company's services focus on the delivery of research, development, qualification, prototyping and small to medium volume manufacturing services, enabling customers from automotive, consumer, industrial, medical, optical and power markets to get one point of contact for all of their packaging business.
Contact Information
Deal Type | Date | Amount | Raised to Date | Post-Val | Status | Stage |
---|---|---|---|---|---|---|
2. Merger/Acquisition | 12-Nov-2018 | Completed | Generating Revenue | |||
1. Early Stage VC | Completed | Generating Revenue |
Publication ID | Patent Title | Status | First Filing Date | Technology (CPC) | Citations |
---|---|---|---|---|---|
EP-2941785-A1 | Through-polymer via (tpv) and method to manufacture such a via | Active | 02-Jan-2013 | 000000000000 | |
EP-2941785-B1 | Through-polymer via (tpv) and method to manufacture such a via | Active | 02-Jan-2013 | 000000000000 | |
US-9576882-B2 | Through polymer via (tpv) and method to manufacture such a via | Active | 02-Jan-2013 | 000000000000 | |
US-20150303131-A1 | Through-polymer via (tpv) and method to manufacture such a via | Active | 02-Jan-2013 | H01L23/49811 |
Name | Title | Board Seat | Contact Info |
---|---|---|---|
John Peters | Chief Technology Officer | ||
Eef Boschman | Managing Director | ||
Henk Gerards | Co-Founder |
Name | Representing | Role | Since |
---|---|---|---|
Marco Koelink Ph.D | Advanced Packaging Center | Board Member & Business Development Manager | 000 0000 |
Investor Name | Investor Type | Holding | Investor Since | Participating Rounds | Contact Info |
---|---|---|---|---|---|
Point One Innovation Fund | Venture Capital | Minority | 000 0000 | 000000 0 |