Boschman Technologies

Boschman Technologies Overview

  • Founded
  • 1990
Founded
  • Status
  • Private
  • Latest Deal Type
  • PE Growth
  • Financing Rounds
  • 1
  • Investments
  • 1

Boschman Technologies General Information

Description

Manufacturer of semiconductor packaging equipment. The company offers molds that are developed, engineered, manufactured and tested using two major encapsulation techniques: transfer molding and potting or glob topping, offering void-free and strong bonds with high thermal and electrical conductivity.

Contact Information

Website
Ownership Status
Privately Held (backing)
Financing Status
Private Equity-Backed
Primary Industry
Other Commercial Products
Other Industries
Other Containers and Packaging
Application Specific Semiconductors
Primary Office
  • Stenograaf 3
  • 6921 EX Duiven
  • Netherlands
+31 026 000 0000
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Boschman Technologies Valuation & Funding

Deal Type Date Amount Valuation/
EBITDA
Post-Val Status Debt

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Boschman Technologies Executive Team (1)

Name Title Board Seat Contact Info
Frank Boschman President & Chief Executive Officer

Boschman Technologies Investors

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info

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Boschman Technologies Acquisitions (1)

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Company Name Deal Date Deal Type Deal Size Industry Lead Partner
00000000 000000000 12-Nov-2018 000000000000000000 Other Business Products and Services 00000 00000000