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Hitachi Metals (processing and cleaning equipment)

M&A STATUS
M&A LATEST DEAL TYPE
1 FINANCING ROUNDS
Description

Provider of equipment. The company provides automated equipment for wax mounting, demounting, edge grinding, wafer sawing, polishing and cleaning for GaAs substrates.

Ownership Status
Acquired/Merged
Financing Status
Corporate Backed or Acquired
Primary Industry
Machinery (B2B)
Acquirer
Primary Office
  • Japan

Hitachi Metals (processing and cleaning equipment) Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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Hitachi Metals (processing and cleaning equipment) Former Investors

Investor Name Investor Type Holding Participating Rounds Investor Since Board Seat Contact Info

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