SIGLEAD Overview

  • Founded
  • 2007
Founded
  • Status
  • Private
  • Latest Deal Type
  • PE Growth
  • Financing Rounds
  • 3

SIGLEAD General Information

Description

Operator of a research and development platform intended to develop signal processing LSI unit. The company's platform is designed to improve the reliability of the SSD and to achieve a high-speed SSD by using an architecture that takes full advantage of the communication speed given by SATA3(6Gbps) as well as supports a wide range of NAND flash generations, enabling enterprises to improve the short product-cycle associated with NAND flash memory's process node.

Contact Information

Website
www.siglead.com
Ownership Status
Privately Held (backing)
Financing Status
Private Equity-Backed
Primary Industry
General Purpose Semiconductors
Primary Office
  • Nakagawachuo, Tsuzuki-ku
  • Kanagawa Lemode Center North 2nd floor
  • Yokohama, 224-0003
  • Japan
+81 000-000-0000
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SIGLEAD Valuation & Funding

Deal Type Date Amount Valuation/
EBITDA
Post-Val Status Debt

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SIGLEAD Executive Team (1)

Name Title Board Seat Contact Info
Atsushi Esumi Chief Executive Officer, President & Director
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SIGLEAD Investors

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info

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