Developer of a compound semiconductor manufacturing platform focused on the development of high-end technologies for microwave radio frequency, power electronics and optical devices. The company offers advanced process technologies by having in-house capability and vertical integration of substrate materials, epitaxy growth and wafer fabrication, enabling businesses to improve process capabilities..
Deal Type | Date | Amount | Valuation/ EBITDA |
Post-Val | Status | Debt |
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Request a free trialName | Title | Board Seat | Contact Info |
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Raymond Cai | Chief Executive Officer |
Company Name | Deal Date | Deal Type | Deal Size | Industry | Lead Partner |
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00000 000000000 00 | 22-Oct-2020 | 00000 0000000 | Industrial Supplies and Parts | 0000000 000 |