XwinSys Technology Development Overview

  • Founded
  • 2012

Founded
  • Status
  • Acquired/​Merged

  • Latest Deal Type
  • M&A

  • Financing Rounds
  • 4

XwinSys Technology Development General Information

Description

Manufacturer of inspection systems designed to automated optical 2 dimension and 3 dimension microscopes. The company's inspection systems integrates intellectual property that combines 2D and 3D image processing technology, along with developing surface scanners of wafers and electronic boards used in semiconductors, enabling semiconductor manufacturers to meet the challenges of roadmap requirements for inspection and metrology of 3D structures.

Contact Information

Website
www.xwinsys.com
Ownership Status
Acquired/Merged
Financing Status
Corporate Backed or Acquired
Primary Industry
Electronic Equipment and Instruments
Other Industries
Diagnostic Equipment
Acquirer
Primary Office
  • P.O.B. 997
  • Migdal Haemek 2310901
  • Israel
+972 00-000-0000

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XwinSys Technology Development Valuation & Funding

Deal Type Date Amount Valuation/
EBITDA
Post-Val Status Debt

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XwinSys Technology Development Comparisons

Description
Primary
Industry
HQ Location
Employees
Total Raised
Post Valuation
Last Financing Details
Manufacturer of inspection systems designed to automated optical 2 dimension and 3 dimension microscopes. The company's
Electronic Equipment and Instruments
Migdal Haemek, Israel
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Tokyo, Japan
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0000000000 000000000 000 00000000000
Wetzlar, Germany
0000 As of 0000
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XwinSys Technology Development Competitors (2)

Company Name Financing Status Location Employees Total Raised Last Financing Date/Type Last Financing Amount
Olympus Corporation Tokyo, Japan 00000 00000 00000000000 00000
00000 000000000000 Formerly PE-Backed Wetzlar, Germany 0000 000000&0
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XwinSys Technology Development Patents

XwinSys Technology Development Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
US-10697908-B2 Metrology inspection apparatus Active 01-Jun-2015 00000000000
US-20180128756-A1 Metrology measuring apparatus Active 01-Jun-2015 0000000000
US-10697907-B2 Metrology measuring apparatus Active 01-Jun-2015 0000000000
US-20180128757-A1 Metrology inspection apparatus Active 01-Jun-2015 0000000000
US-9335283-B2 Method and a system for recognizing voids in a bump Active 12-Sep-2011 G01N23/22
To view XwinSys Technology Development’s complete patent history, request access »

XwinSys Technology Development Former Investors

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info

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