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ASYANS

ASYANS
2005 FOUNDED
M&A STATUS
M&A LATEST DEAL TYPE
1 FINANCING ROUNDS
Description

Developer of design platforms for building 3D chips intended to serve applications with overall higher capacities and significant advantages in comparison to existing constructions and compositions. The company's design platform includes patents and patents pending of the uplex®, a new chip design platform invention which is multi-programmable has maximized security, high processing power of 40-100Mips and a memory of 1GB up to 64GB in one product.

Website
Ownership Status
Acquired/Merged
Financing Status
Corporate Backed or Acquired
Primary Industry
Electronic Components
Acquirer
Primary Office
  • Hong Kong
  • Hong Kong

ASYANS Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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