Compound Semiconduclor Overview

  • Year Founded
  • 2020

Year Founded

  • Status
  • Private

  • Latest Deal Type
  • Early Stage VC

  • Investors
  • 3

Compound Semiconduclor General Information

Description

Developer and manufacturer of substrate materials and devices designed for wide bandgap semiconductors. The company focuses on the research, development, production and sales of wide bandgap semiconductor substrate materials and devices including wafer-level diamond substrates, diamond heat sinks, GaN on Diamond, Diamond on GaN, silicon-based aluminum nitride, sapphire-based aluminum nitride, diamond-based aluminum nitride, providing customers with stable and excellent semiconductor components.

Contact Information

Website
www.csmh-semi.com
Ownership Status
Privately Held (backing)
Financing Status
Venture Capital-Backed
Corporate Office
  • No.253, Building 10
  • Guankou Avenue, Jimei District
  • Xiamen, Fujian
  • China
+86 0592
Primary Industry
Electrical Equipment
Vertical(s)
Manufacturing
Corporate Office
  • No.253, Building 10
  • Guankou Avenue, Jimei District
  • Xiamen, Fujian
  • China
+86 0592

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Compound Semiconduclor Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
3. Early Stage VC 20-Mar-2024 Completed Generating Revenue
2. Early Stage VC 30-Jun-2022 Completed Generating Revenue
1. Accelerator/Incubator 12-Nov-2020 Completed Startup
To view Compound Semiconduclor’s complete valuation and funding history, request access »

Compound Semiconduclor Patents

  • 5

    Total Documents Applications and Grants

  • Total Patents Families

  • 2

    Granted

  • 3

    Pending

  • Expiring in next 12 mo

Compound Semiconduclor Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
US-20260242977-A1 Method for growing ultra-large-size polycrystalline diamond films Pending 19-Feb-2025
US-20260247884-A1 Ultra-large-size silicon device with diamond-based heat dissipation and preparation method thereof Pending 19-Feb-2025
WO-2026019059-A1 Heat dissipation member Pending 19-Jul-2024
DE-202024101584-U1 Chip test seat with high heat dissipation Active 10-Apr-2023
JP-3246985-U Chip test seat with high heat dissipation Active 10-Apr-2023 G01R1/0458
To view Compound Semiconduclor’s complete patent history, request access »

Compound Semiconduclor Investors (3)

Investor Name Investor Type Holding Investor Since Participating Rounds
Heraeus Holding Corporation Minority
CM Venture Capital Venture Capital Minority
Jimei University University Minority
To view Compound Semiconduclor’s complete investors history, request access »

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Compound Semiconduclor FAQs

  • When was Compound Semiconduclor founded?

    Compound Semiconduclor was founded in 2020.

  • Where is Compound Semiconduclor headquartered?

    Compound Semiconduclor is headquartered in Xiamen, China.

  • What industry is Compound Semiconduclor in?

    Compound Semiconduclor’s primary industry is Electrical Equipment.

  • Is Compound Semiconduclor a private or public company?

    Compound Semiconduclor is a Private company.

  • What is Compound Semiconduclor’s current revenue?

    The current revenue for Compound Semiconduclor is .

  • Who are Compound Semiconduclor’s investors?

    Heraeus Holding, CM Venture Capital, and Jimei University have invested in Compound Semiconduclor.

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