Echint Technology Overview
- Year Founded
-
2017
- Status
-
Private
- Employees
-
41
- Latest Deal Type
-
Series C
- Investors
-
24
Echint Technology General Information
Description
Provider of semiconductor packaging and testing services intended to support high-density integrated circuit integration. The company offers high-density board-level packaging technology with wafer-level precision, chip offset control, warpage management, and redistribution layer processes, enabling semiconductor manufacturers to enhance chip functionality and reliability for mobile terminals, 5G, IoT, artificial intelligence, high-performance computing, and automotive electronics.
Contact Information
Website
www.echint.comCorporate Office
- Number 1866, Kangqiang Third Road
- High-tech West Zone
- Chengdu, Sichuan 610000
- China
Corporate Office
- Number 1866, Kangqiang Third Road
- High-tech West Zone
- Chengdu, Sichuan 610000
- China
Echint Technology Timeline
Echint Technology Valuation & Funding
| Deal Type | Date | Amount | Raised to Date | Post-Val | Status | Stage |
|---|---|---|---|---|---|---|
| 9. Later Stage VC (Series C) | 05-Nov-2026 | Completed | Generating Revenue | |||
| 8. Later Stage VC | 29-Jul-2026 | Completed | Generating Revenue | |||
| 7. Later Stage VC | 01-Apr-2026 | Completed | Generating Revenue | |||
| 6. Later Stage VC (Series B) | 18-Aug-2023 | Completed | Generating Revenue | |||
| 5. Secondary Transaction - Private | 26-May-2023 | Completed | Generating Revenue | |||
| 4. Early Stage VC (Series A) | 19-May-2022 | Completed | Generating Revenue | |||
| 3. Secondary Transaction - Private | 12-Dec-2019 | Completed | Generating Revenue | |||
| 2. Secondary Transaction - Private | Completed | Generating Revenue | ||||
| 1. Secondary Transaction - Private | Completed | Generating Revenue |
Echint Technology Patents
Echint Technology Recent Patent Activity
| Publication ID | Patent Title | Status | First Filing Date | Technology (CPC) | Citations |
|---|---|---|---|---|---|
| US-12438086-B2 | Semiconductor package and method of forming the same with dielectric layer disposed between protective mold structure and stepped structure of side portion of semiconductor die | Active | 29-Mar-2022 | ||
| US-12199025-B2 | Interposer structure containing embedded silicon-less link chiplet | Active | 22-Mar-2021 |
Echint Technology Signals
Echint Technology Investors (24)
| Investor Name | Investor Type | Holding | Investor Since | Participating Rounds |
|---|---|---|---|---|
| Chengdu High-tech Investment Biomedical Park Management Company | Corporation | Minority | ||
| Chipmore Technology | Corporation | Minority | ||
| China Internet Investment Fund | Venture Capital | Minority | ||
| Baizhuangde Capital | Growth/Expansion | Minority | ||
| BC Global Asset Management | Asset Manager | Minority |
Echint Technology FAQs
-
When was Echint Technology founded?
Echint Technology was founded in 2017.
-
Where is Echint Technology headquartered?
Echint Technology is headquartered in Chengdu, China.
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What is the size of Echint Technology?
Echint Technology has 41 total employees.
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What industry is Echint Technology in?
Echint Technology’s primary industry is Other Semiconductors.
-
Is Echint Technology a private or public company?
Echint Technology is a Private company.
-
What is Echint Technology’s current revenue?
The current revenue for Echint Technology is .
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How much funding has Echint Technology raised over time?
Echint Technology has raised $146M.
-
Who are Echint Technology’s investors?
Chengdu High-tech Investment Biomedical Park Management Company, Chipmore Technology, China Internet Investment Fund, Baizhuangde Capital, and BC Global Asset Management are 5 of 24 investors who have invested in Echint Technology.
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