Hi-CORE Overview

  • Year Founded
  • 2022

Year Founded

  • Status
  • Private

  • Latest Deal Type
  • Series A

  • Investors
  • 6

Hi-CORE General Information

Description

Manufacturer of chips designed for radar microsystems. The company's technology utilizes silicon-based processes and terahertz radio-frequency integrated circuits to support millimeter-wave chip design, thereby enabling industrial users to access sensing and communication solutions for security detection, 5g communications and industrial monitoring.

Contact Information

Ownership Status
Privately Held (backing)
Financing Status
Venture Capital-Backed
Corporate Office
  • Unit 1, Building 8, Block B, Western Wisdom Valley
  • Wuhou District
  • Chengdu, Sichuan 610041
  • China
+86 159
Primary Industry
Application Specific Semiconductors
Other Industries
Aerospace and Defense
Vertical(s)
Corporate Office
  • Unit 1, Building 8, Block B, Western Wisdom Valley
  • Wuhou District
  • Chengdu, Sichuan 610041
  • China
+86 159

Hi-CORE Timeline

2023202420252026
Date FoundedFinancing Round

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Hi-CORE Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
4. Early Stage VC (Series A) 31-Aug-2026 Completed Generating Revenue
3. Early Stage VC 12-Feb-2026 Completed Generating Revenue
2. Early Stage VC 18-Dec-2023 $140K $140K Completed Generating Revenue
1. Seed Round 24-Mar-2023 Completed Startup
To view Hi-CORE’s complete valuation and funding history, request access »

Hi-CORE Investors (6)

Investor Name Investor Type Holding Investor Since Participating Rounds
Chengdu Chenghua Technology Venture Capital Growth/Expansion Minority
Chengdu Technology Transfer Venture Corporate Venture Capital Minority
Beyond Capital (Chengdu) PE/Buyout Minority
Oriental Fortune Capital Venture Capital Minority
Rongtong Hongtai Venture Capital Minority
You’re viewing 5 of 6 investors. Get the full list »

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