Häusermann Overview

  • Founded
  • 1907

Founded

  • Status
  • Acquired/​Merged

  • Employees
  • 200

Employees

  • Latest Deal Type
  • M&A

  • Financing Rounds
  • 3

Häusermann General Information

Description

Manufacturer of printed circuit boards designed for high-current or light-emitting diode applications. The company's printed circuit boards are suitable for applications that require high currents and require efficient heat management allowing the partial incorporation of large copper cross sections into standard circuit boards and thus integrating currents with the finest conductor structures in one board, thereby enabling in an increase in the current carrying capacity while at the same time minimizing the space requirement for high-current conductor cables as well as a reduction in the overall costs from logistics to quality assurance.

Contact Information

Website
www.haeusermann.at
Ownership Status
Acquired/Merged
Financing Status
Formerly PE-Backed
Primary Industry
General Purpose Semiconductors
Other Industries
Other Hardware
IT Consulting and Outsourcing
Acquirer
KSG PCB
Primary Office
  • Zitternberg 100
  • Gars am Kamp, 3571
  • Austria

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Häusermann Valuation & Funding

Deal Type Date Amount Valuation/
EBITDA		 Post-Val Status Debt

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Häusermann Patents

  • 30

    Total Documents Applications and Grants

  • 000

    Total Patents Families

  • 6

    Granted

  • 000

    Pending

  • 000

    Expiring in next 12 mo

Häusermann Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
DE-102016005291-A1 Process for producing an electronic device in the form of an injection-molded part with an inserted printed circuit board Pending 29-Apr-2016 000000000
EP-3240099-A1 Method for producing an electronic device in the form of an injection molded part having inserted printed circuit board Inactive 29-Apr-2016 000000000 0
DE-102016001810-A1 Method for producing a printed circuit board with reinforced copper structure Inactive 17-Feb-2016 000000000 00
DE-102015001652-A1 Method of making a via in a multilayer printed circuit board Inactive 12-Feb-2015 000000000 0
EP-3257335-A1 Method for producing a plated-through hole in a multilayer printed circuit board Inactive 12-Feb-2015 H05K3/429
To view Häusermann’s complete patent history, request access »

Häusermann Signals

Growth Rate

0.80% Weekly
Growth
Weekly Growth 0.80%, 93rd %
-35.5%. 530%

Size Multiple

219x Median
Size Multiple 219x, 100th %ile
0.00x 0.95x. 413Kx

Key Data Points

Twitter Followers

5.5k

Similarweb Unique Visitors

15.0K

Majestic Referring Domains

314

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Häusermann Former Investors

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info

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