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30Total Documents Applications and Grants
000Total Patents Families
000Expiring in next 12 mo
|Publication ID||Patent Title||Status||First Filing Date||Technology (CPC)||Citations|
|DE-102016005291-A1||Process for producing an electronic device in the form of an injection-molded part with an inserted printed circuit board||Pending||29-Apr-2016||000000000|
|EP-3240099-A1||Method for producing an electronic device in the form of an injection molded part having inserted printed circuit board||Inactive||29-Apr-2016||000000000||0|
|DE-102016001810-A1||Method for producing a printed circuit board with reinforced copper structure||Inactive||17-Feb-2016||000000000||00|
|DE-102015001652-A1||Method of making a via in a multilayer printed circuit board||Inactive||12-Feb-2015||000000000||0|
|EP-3257335-A1||Method for producing a plated-through hole in a multilayer printed circuit board||Inactive||12-Feb-2015||H05K3/429|
|Investor Name||Investor Type||Holding||Investor Since||Participating Rounds||Contact Info|