Agape Package Manufacturing Overview

  • Founded
  • 2004
  • Status
  • Acquired/​Merged
  • Latest Deal Type
  • M&A
  • Latest Deal Amount
  • $40M
Latest Deal Amount

Agape Package Manufacturing General Information


Provider of semiconductor packaging and testing services. The company develops and supplies wide range of power semiconductors.

Contact Information

Ownership Status
Financing Status
Formerly VC-backed
Primary Industry
Application Specific Semiconductors
Other Industries
Other Semiconductors
Primary Office
  • #B1 Building,Dongkai Industrial Park
  • Songjiang
  • Shanghai, 201614
  • China
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Agape Package Manufacturing Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
2. Merger/Acquisition 03-Dec-2010 $40M 0000 00000 Completed Product Development
1. Early Stage VC (Series A) 20-Jan-2005 0000 0000 Completed Product Development
To view Agape Package Manufacturing’s complete valuation and funding history, request access »

Agape Package Manufacturing Former Investors (3)

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info
AOI ELECTRONICS Company Corporation Minority 000 0000 000000 0
China-Singapore Suzhou Industrial Park Ventures Venture Capital Minority 000 0000 000000 0
JAFCO Asia Venture Capital Minority 000 0000 000000 0
To view Agape Package Manufacturing’s complete investors history, request access »