XPTC Overview

  • Year Founded
  • 2021

Year Founded

  • Status
  • Private

  • Latest Deal Type
  • Early Stage VC

  • Investors
  • 19

XPTC General Information

Description

Manufacturer of semiconductor wafer processing equipment designed for advanced packaging and chip fabrication. The company's technology utilizes precision control technology, ultra-precision edge trimming, and 3D stacking processes, providing semiconductor manufacturers and advanced packaging facilities with wafer thinning machines, edge trimming equipment, dicing machines, and supporting consumables to facilitate chip manufacturing upgrades and back-end process automation.

Contact Information

Ownership Status
Privately Held (backing)
Financing Status
Venture Capital-Backed
Corporate Office
  • Number 1608, Bingmasi Road
  • Yuyao
  • Ningbo, Zhejiang 315400
  • China
+86 158
Primary Industry
Machinery (B2B)
Other Industries
Other Semiconductors
Vertical(s)
Corporate Office
  • Number 1608, Bingmasi Road
  • Yuyao
  • Ningbo, Zhejiang 315400
  • China
+86 158

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XPTC Valuation & Funding

Deal Type Date Amount Raised to Date Post-Val Status Stage
5. Early Stage VC 21-Apr-2026 Completed Generating Revenue
4. Secondary Transaction - Private 24-Mar-2026 Completed Generating Revenue
3. Early Stage VC (Series B) 04-Dec-2025 Completed Generating Revenue
2. Early Stage VC 30-Sep-2025 Completed Generating Revenue
1. Early Stage VC (Series A) 14-Jul-2024 Completed Generating Revenue
To view XPTC’s complete valuation and funding history, request access »

XPTC Investors (19)

Investor Name Investor Type Holding Investor Since Participating Rounds
Hubei Guoyi Investment Management Growth/Expansion Minority
Dongyuan Venture Capital Growth/Expansion Minority
Hubei Jiangcheng Private Equity Fund Management PE/Buyout Minority
Zhejiang Zhecai Innovation and Entrepreneurship Investment Company Government Minority
Beyond Capital (Chengdu) PE/Buyout Minority
You’re viewing 5 of 19 investors. Get the full list »

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