Sound Design Technologies
1973
FOUNDED
M&A
STATUS
M&A
LATEST DEAL TYPE
2
FINANCING ROUNDS
1
INVESTMENTS
Description
Manufacturer of ultra-low power semiconductor solutions for hearing instruments. The company is also leading provider of advanced high density interconnect technologies used in custom miniaturized 3D Multi-Chip Modules (MCM), System-In-Package (SIP) and Stacked Chip Scale Packages (S-CSP).
Website
Ownership Status
Acquired/Merged
Financing Status
Formerly PE-Backed
Primary Industry
Therapeutic Devices
Acquirer
Primary Office
- Station A
- 970 Fraser Drive
- Burlington, Ontario L7L 5P5
- Canada
Sound Design Technologies Valuation and Funding
| Deal Type | Date | Amount | Post-Val | Valuation/ EBITDA |
Debt | Status |
|---|
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| Company Name | Deal Date | Deal Type | Deal Size | Industry | Lead Partner |
|---|---|---|---|---|---|
| 000000 (0000000 00 | 26-Oct-2007 | 0000000000 | 000.00 | Other Commercial Products | 000 00000 |
Sound Design Technologies Former Investors
| Investor Name | Investor Type | Holding | Participating Rounds | Investor Since | Board Seat | Contact Info |
|---|
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Request full access to PitchBookSound Design Technologies Executive Team (4)
| Name | Title | Board Seat |
Contact Info |
|---|---|---|---|
| Scott Haddow | Senior Vice President, Operations | ||
| Tracy Browne | Associate, Corporate Inquiries |
2 Former Executives
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