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Sound Design Technologies

1973 FOUNDED
M&A STATUS
M&A LATEST DEAL TYPE
2 FINANCING ROUNDS
1 INVESTMENTS
Description

Manufacturer of ultra-low power semiconductor solutions for hearing instruments. The company is also leading provider of advanced high density interconnect technologies used in custom miniaturized 3D Multi-Chip Modules (MCM), System-In-Package (SIP) and Stacked Chip Scale Packages (S-CSP).

Ownership Status
Acquired/Merged
Financing Status
Formerly PE-Backed
Primary Industry
Therapeutic Devices
Acquirer
Primary Office
  • Station A
  • 970 Fraser Drive
  • Burlington, Ontario L7L 5P5
  • Canada

Sound Design Technologies Valuation and Funding

Deal Type Date Amount Post-Val Valuation/
EBITDA
Debt Status

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Sound Design Technologies Investments (1)

Company Name Deal Date Deal Type Deal Size Industry Lead Partner
000000 (0000000 00 26-Oct-2007 0000000000 000.00 Other Commercial Products 000 00000
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Sound Design Technologies Former Investors

Investor Name Investor Type Holding Participating Rounds Investor Since Board Seat Contact Info

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Sound Design Technologies Executive Team (4)

Name Title Board
Seat
Contact
Info
Scott Haddow Senior Vice President, Operations
Tracy Browne Associate, Corporate Inquiries

2 Former Executives

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