Sound Design Technologies Overview

  • Founded
  • 1973

Founded
  • Status
  • Acquired/​Merged

  • Latest Deal Type
  • M&A

  • Financing Rounds
  • 2

  • Investments
  • 1

Sound Design Technologies General Information

Description

Manufacturer of ultra-low power semiconductor solutions for hearing instruments. The company is also leading provider of advanced high density interconnect technologies used in custom miniaturized 3D Multi-Chip Modules (MCM), System-In-Package (SIP) and Stacked Chip Scale Packages (S-CSP).

Contact Information

Ownership Status
Acquired/Merged
Financing Status
Formerly PE-Backed
Primary Industry
Application Specific Semiconductors
Other Industries
Other Commercial Services
Acquirer
Primary Office
  • Station A
  • 970 Fraser Drive
  • Burlington, Ontario L7L 5P5
  • Canada

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Sound Design Technologies Valuation & Funding

Deal Type Date Amount Valuation/
EBITDA
Post-Val Status Debt

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Sound Design Technologies Patents

Sound Design Technologies Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
US-20110210411-A1 Ultra thin flip-chip backside device sensor package Abandoned 26-Feb-2010 0000000000 0
US-20090087010-A1 Carrier chip with cavity Abandoned 27-Sep-2007 000000000 0
EP-2193539-A1 Carrier chip with cavity Withdrawn 27-Sep-2007 000000000
US-20080123866-A1 Hearing instrument with acoustic blocker, in-the-ear microphone and speaker Abandoned 29-Nov-2006 0000000000 00
US-20080118095-A1 Wax guard for a hearing aid Abandoned 22-Nov-2006 H04R25/654 0
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Sound Design Technologies Executive Team (3)

Name Title Board Seat Contact Info
Tracy Browne Associate, Corporate Inquiries
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Sound Design Technologies Former Investors

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info

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Sound Design Technologies Investments (1)

Company Name Deal Date Deal Type Deal Size Industry Lead Partner
000000 (00000 26-Oct-2007 0000000000 000.00 Other Commercial Products 000 00000
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