Sound Design Technologies Overview
- Founded
- 1973
- Status
- Acquired/Merged
- Latest Deal Type
- M&A
- Financing Rounds
- 2
- Investments
- 1
Sound Design Technologies General Information
Description
Manufacturer of ultra-low power semiconductor solutions for hearing instruments. The company is also leading provider of advanced high density interconnect technologies used in custom miniaturized 3D Multi-Chip Modules (MCM), System-In-Package (SIP) and Stacked Chip Scale Packages (S-CSP).
Contact Information
Website
Ownership Status
Acquired/Merged
Financing Status
Formerly PE-Backed
Primary Industry
Therapeutic Devices
Acquirer
Primary Office
- Station A
- 970 Fraser Drive
- Burlington, Ontario L7L 5P5
- Canada
Sound Design Technologies Valuation & Funding
| Deal Type | Date | Amount | Valuation/ EBITDA |
Post-Val | Status | Debt |
|---|
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Request a free trialSound Design Technologies Executive Team (4)
| Name | Title | Board Seat | Contact Info |
|---|---|---|---|
| Scott Haddow | Senior Vice President, Operations | ||
| Tracy Browne | Associate, Corporate Inquiries |
Sound Design Technologies Former Investors
| Investor Name | Investor Type | Holding | Investor Since | Participating Rounds | Contact Info |
|---|
This information is available in the PitchBook Platform. To explore Sound Design Technologies‘s full profile, request access.
Request a free trialSound Design Technologies Investments (1)
| Company Name | Deal Date | Deal Type | Deal Size | Industry | Lead Partner |
|---|---|---|---|---|---|
| 000000 (0000000 00 | 26-Oct-2007 | 0000000000 | 000.00 | Other Commercial Products | 000 00000 |