SEMX Overview
- Year Founded
-
1981

- Status
-
Acquired/Merged
- Employees
-
115

- Latest Deal Type
-
Buyout/LBO
- Financing Rounds
-
3
SEMX General Information
Description
Manufacturer of interconnect products and materials for critical components and other specialized microelectronic devices and systems. The company offers bonding wire, tape on reel and waffle packaged products and services and produces precision metal stampings out of various materials for interconnect, heat dissipation, soldering, brazing, bonding pad and lead frame.
Contact Information
Website
www.semx.com
Formerly Known As
Semiconductor Packaging Materials
Ownership Status
Acquired/Merged
Financing Status
Private Equity-Backed
Primary Industry
Industrial Supplies and Parts
Other Industries
Other Commercial Services
Acquirer
Primary Office
- One Labriola Court
- Armonk, NY 10504
- United States
SEMX Valuation & Funding
Deal Type | Date | Amount | Valuation/ EBITDA |
Post-Val | Status | Debt |
---|
SEMX Patents
SEMX Recent Patent Activity
Publication ID | Patent Title | Status | First Filing Date | Technology (CPC) | Citations |
---|---|---|---|---|---|
US-20100163608-A1 | Method for depositing solder material on an electronic component part | Inactive | 30-Dec-2005 | 0000000000 | |
US-20070152017-A1 | Method for depositing solder material on an electronic component part | Active | 30-Dec-2005 | 0000000000 | |
US-7946470-B2 | Method for depositing solder material on an electronic component part using separators | Inactive | 30-Dec-2005 | 0000000000 | 00 |
US-20070152023-A1 | Solder deposit method on electronic packages for post-connection process | Inactive | 30-Dec-2005 | 0000000000 | 00 |
US-20030080232-A1 | Dynamic tensioning for wire-winding device | Active | 27-Oct-2001 | B65H59/04 |
SEMX Signals
SEMX Former Investors
Investor Name | Investor Type | Holding | Investor Since | Participating Rounds | Contact Info |
---|