U-Bond Technology Overview
- Year Founded
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2003
- Status
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IPO Registration
- Employees
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813
- Latest Deal Type
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IPO
- (Announced)
- Financing Rounds
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9
U-Bond Technology General Information
Description
Developer and manufacturer of electronic assembly materials designed for intelligent terminals, communications, new energy and semiconductor fields. The company focuses on the research and development, production and sales of electronic assembly materials and supporting automation equipment such as electronic adhesives, electronic soldering materials, semiconductor special materials, automatic dispensing equipment, providing industrial customers with soldering, bonding, surface treatment and other electronic packaging solution.
Contact Information
Website
u-bondtech.comCorporate Office
- Room 101, Building 1, No. 1, Datang Yanhe Street
- Dalingshan Town
- Dongguan, Guangdong 523016
- China
Corporate Office
- Room 101, Building 1, No. 1, Datang Yanhe Street
- Dalingshan Town
- Dongguan, Guangdong 523016
- China
U-Bond Technology Valuation & Funding
| Deal Type | Date | Amount | Valuation/ EBITDA |
Post-Val | Status | Debt |
|---|
U-Bond Technology Related Research & Analysis
Explore institutional-grade private market research from our team of analysts.
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Verticals
U-Bond Technology Patents
U-Bond Technology Recent Patent Activity
| Publication ID | Patent Title | Status | First Filing Date | Technology (CPC) | Citations |
|---|---|---|---|---|---|
| WO-2026219007-A1 | Liquid-metal-based composite thermally-conductive silicone grease, preparation method therefor, and use thereof | Pending | 14-Apr-2025 | ||
| WO-2024108705-A1 | Soft-package glue supply machine | Inactive | 24-Nov-2022 |
U-Bond Technology Signals
Growth Rate
Growth
Size Multiple
Key Data Points
Similarweb Unique Visitors
Majestic Referring Domains
U-Bond Technology Investors
| Investor Name | Investor Type | Holding | Investor Since | Participating Rounds | Contact Info |
|---|
U-Bond Technology FAQs
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When was U-Bond Technology founded?
U-Bond Technology was founded in 2003.
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Where is U-Bond Technology headquartered?
U-Bond Technology is headquartered in Dongguan, China.
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What is the size of U-Bond Technology?
U-Bond Technology has 813 total employees.
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What industry is U-Bond Technology in?
U-Bond Technology’s primary industry is Industrial Supplies and Parts.
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Is U-Bond Technology a private or public company?
U-Bond Technology is a Private company.
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What is U-Bond Technology’s current revenue?
The current revenue for U-Bond Technology is .
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How much funding has U-Bond Technology raised over time?
U-Bond Technology has raised $45.8M.
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Who are U-Bond Technology’s investors?
Qingshi Asset Management (Shanghai), Shenzhen Capital Holdings, CrestValue Capital, Beijing Zhiming Haojin Investment Management, and Guangdong Ruifeng Investment are 5 of 7 investors who have invested in U-Bond Technology.
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