Winbond Electronics Overview

  • Year Founded
  • 1987

Year Founded

  • Status
  • Public

  • Employees
  • 3,625

Employees

  • Stock Symbol
  • 2344

Stock Symbol

  • Investments
  • 6

  • Share Price
  • $3.88
  • (As of Thursday Closing)

Winbond Electronics General Information

Description

Winbond Electronics Corp is engaged in the design, development, manufacture, and marketing of very large scale integration (VLSI) integrated circuits (ICs) used in a variety of microelectronic applications. In addition, it offers customised memory solutions like Mobile RAM and Specialty DRAM, and core storage flash memory products. The company's operating segments are Customized Memory Solution product, Flash Memory product, and Logic IC product. Maximum revenue is generated from the Flash Memory product segment, which engages mainly in the manufacturing, selling, researching, designing and after-sales service of Flash Memory product. Geographically, the company generates maximum revenue from Asia, followed by America, Europe, and Other regions.

Contact Information

Website
www.winbond.com
Ownership Status
Publicly Held
Financing Status
Corporation
Corporate Office
  • Number 8, Keya 1st Road, Central Science Park
  • Daya District
  • Taichung
  • Taiwan
+886 04
Primary Industry
Application Specific Semiconductors
Other Industries
Production (Semiconductors)
Stock Exchange
TAI
Vertical(s)
Corporate Office
  • Number 8, Keya 1st Road, Central Science Park
  • Daya District
  • Taichung
  • Taiwan
+886 04

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Winbond Electronics Stock Performance

As of 12-Nov-2026, Winbond Electronics’s stock price is $3.88. Its current market cap is $17.4B with 4.5B shares.

(As of Thursday Closing)

Stock Price Previous Close 52 wk Range Market Cap Shares Average Volume EPS
$3.88 $4.14 $1.66 - $7.36 $17.4B 4.5B 95.7M $0.51

Winbond Electronics Financials Summary

As of 30-Sep-2026, Winbond Electronics has a trailing 12-month revenue of $6.56B.

In Thousands,
USD
TTM 30-Sep-2026 FY 2025 31-Dec-2025 FY 2024 31-Dec-2024 FY 2023 31-Dec-2023
EV 25,862,298 13,113,772 3,127,110 5,229,424
Revenue 6,556,184 2,865,972 2,543,109 2,408,050
EBITDA 3,421,312 587,384 457,176 379,369
Net Income 2,320,228 127,002 18,728 (36,809)
Total Assets 10,548,962 6,145,505 5,406,403 6,208,928
Total Debt 1,301,462 1,734,259 1,681,642 1,894,067
Public Fundamental Data provided by Morningstar, Inc. disclaimer

Winbond Electronics Valuation & Funding

Deal Type Date Amount Valuation/
EBITDA
Post-Val Status Debt

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Winbond Electronics Comparisons

Description
Primary
Industry
HQ Location
Employees
Total Raised
Post Valuation
Last
Financing
Details
Winbond Electronics Corp is engaged in the design, development, manufacture, and marketing of very large scale integrati
Application Specific Semiconductors
Taichung, Taiwan
3,625 As of 2015

Hsin-chu, Taiwan
 

New Taipei, Taiwan
 
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Winbond Electronics Competitors (16)

One of Winbond Electronics’s 16 competitors is Macronix International, a Formerly VC-backed company based in Hsin-chu, Taiwan.

Company Name Financing Status Location Employees Total Raised Last Financing Date/Type Last Financing Amount
Macronix International Formerly VC-backed Hsin-chu, Taiwan
Nanya Technology Corporation New Taipei, Taiwan
Taiwan Semiconductor Manufacturing Company Corporation Hsinchu, Taiwan
Infineon Technologies Corporation Neubiberg, Germany
Broadcom Formerly PE-Backed Palo Alto, CA
You’re viewing 5 of 16 competitors. Get the full list »

Winbond Electronics Patents

Winbond Electronics Recent Patent Activity

Publication ID Patent Title Status First Filing Date Technology (CPC) Citations
JP-7920418-B1 Semiconductor memory devices and semiconductor devices Active 11-Nov-2025
JP-7919515-B1 Memory systems, semiconductor memory devices, and methods for controlling the same. Active 03-Oct-2025
JP-7919516-B1 Receiving circuit and semiconductor memory device equipped therewith Active 03-Oct-2025
JP-7930664-B1 Semiconductor structure Active 20-May-2025
US-20260343924-A1 Method of forming semiconductor structure Pending 29-Apr-2025 H10D30/0411
To view Winbond Electronics’s complete patent history, request access »

Winbond Electronics Signals

Growth Rate

Weekly
Growth
Weekly Growth

Size Multiple

Median
Size Multiple

Key Data Points

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Winbond Electronics Investors

Investor Name Investor Type Holding Investor Since Participating Rounds Contact Info

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Winbond Electronics Investments & Acquisitions (6)

Winbond Electronics’s most recent deal was a Later Stage VC with UCUN Data. The deal was made on 29-Sep-2026.

Company Name Deal Date Deal Type Deal Size Industry Lead Partner
UCUN Data 29-Sep-2026 Later Stage VC Computers, Parts and Peripherals
Infineon Technologies (NOR Flash Memory and Ferroelectric RAM Business) 16-Sep-2026 Merger/Acquisition Production (Semiconductors)
IQM Finland 15-Aug-2025 Later Stage VC Computers, Parts and Peripherals
Kneron 19-Jan-2021 Later Stage VC Application Specific Semiconductors
Kneron 27-Nov-2017 Early Stage VC Application Specific Semiconductors
You’re viewing 5 of 6 investments and acquisitions. Get the full list »

Winbond Electronics ESG

Risk Overview

Risk Rating

Updated November, 11, 2026

26.39 | Med Risk

Risk Scale

A lower score indicates better sustainability

Negl

0-10

Low

10-20

Med

20-30

High

30-40

Severe

40+

Exposure

Exposure refers to the extent to which a company is exposed to different material ESG issues

Management

Management is related to actions taken to manage ESG issues

Peers Analysis

Peer performance insights compare the company’s ESG performance to the performance of selected peers to help inform future ESG decisions and drive internal performance improvements.

Global

Covered Companies

of 13,585

Rank

Percentile

Semiconductors

Industry

of 350

Rank

Percentile

Semiconductor Design and Manufacturing

Subindustry

of 228

Rank

Percentile

To view Winbond Electronics’s complete esg history, request access »

Winbond Electronics Exits (1)

Winbond Electronics’s most recent exit was on 15-Aug-2025 from IQM Finland. The exit was categorized as with 10 buyers.

Company Name Exit Date Exit Type Exit Size Status Buyers
IQM Finland 15-Aug-2025 Completed
  • 10 buyers
To view Winbond Electronics’s complete exits history, request access »

Winbond Electronics Affiliates

Subsidiaries (1)

Name Industry Location Year Founded
Winbond Electronics Corporation America San Jose, CA 1990

Winbond Electronics FAQs

  • When was Winbond Electronics founded?

    Winbond Electronics was founded in 1987.

  • Where is Winbond Electronics headquartered?

    Winbond Electronics is headquartered in Taichung, Taiwan.

  • What is the size of Winbond Electronics?

    Winbond Electronics has 3,625 total employees.

  • What industry is Winbond Electronics in?

    Winbond Electronics’s primary industry is Application Specific Semiconductors.

  • Is Winbond Electronics a private or public company?

    Winbond Electronics is a Public company.

  • What is Winbond Electronics’s stock symbol?

    The ticker symbol for Winbond Electronics is 2344.

  • What is the current stock price of Winbond Electronics?

    As of 12-Nov-2026 the stock price of Winbond Electronics is $3.88.

  • What is the current market cap of Winbond Electronics?

    The current market capitalization of Winbond Electronics is $17.4B.

  • What is Winbond Electronics’s current revenue?

    The trailing twelve month revenue for Winbond Electronics is $6.56B.

  • Who are Winbond Electronics’s competitors?

    Macronix International, Nanya Technology, Taiwan Semiconductor Manufacturing Company, Infineon Technologies, and Broadcom are some of the 16 competitors of Winbond Electronics.

  • What is Winbond Electronics’s annual earnings per share (EPS)?

    Winbond Electronics’s EPS for 12 months was $0.51.

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